Event Beta

IEEE Symposium in Low-Power and High-Speed Chips, COOL CHIPS 2023, Tokyo, Japan, April 19-21, 2023

Name: IEEE Symposium in Low-Power and High-Speed Chips, COOL CHIPS 2023, Tokyo, Japan, April 19-21, 2023
Location: Tokyo

Date: 2023
Place: Tokyo, Japan on the map
Series: International Symposium on Low-Power and High-Speed Chips (COOL Chips)
Academic field: Natural sciences: Computer and information sciences
Identifier: https://id.confref.org/event/e10xea1

Proceedings

Title	DOI	Year	Record
IEEE Symposium in Low-Power and High-Speed Chips, COOL CHIPS 2023, Tokyo, Japan, April 19-21, 2023	10.1109/coolchips57690.2023	2023	dblp

Sources

The records of the sources that this identifier brings together (cr:sameAs).

dblp	`https://dblp.org/db/conf/coolchips/coolchips2023`

Cite

IEEE Symposium in Low-Power and High-Speed Chips, COOL CHIPS 2023, Tokyo, Japan, April 19-21, 2023. confref identifier e10xea1. https://id.confref.org/event/e10xea1

Data: Turtle · JSON-LD · N-Triples · RDF/XML

APIs · SPARQL · About the identifiers

Beta confref labs is under development. Identifiers are stable; pages, data and services can change.