Event Beta

4th IEEE/ACM International Conference on Technical Debt, TechDebt@ICSE 2021, Madrid, Spain, May 19-21, 2021

Name: 4th IEEE/ACM International Conference on Technical Debt, TechDebt@ICSE 2021, Madrid, Spain, May 19-21, 2021
Location: Madrid

Date: 2021
Place: Madrid, Spain on the map
Series: International Conference on Technical Debt (TechDebt)
Edition: 4
Academic field: Natural sciences: Computer and information sciences
Identifier: https://id.confref.org/event/e11ac2s

Proceedings

Title	DOI	Year	Record
4th IEEE/ACM International Conference on Technical Debt, TechDebt@ICSE 2021, Madrid, Spain, May 19-21, 2021	10.1109/techdebt52882.2021	2021	dblp

Sources

The records of the sources that this identifier brings together (cr:sameAs).

dblp	`https://dblp.org/db/conf/icse/techdebt2021`

Cite

4th IEEE/ACM International Conference on Technical Debt, TechDebt@ICSE 2021, Madrid, Spain, May 19-21, 2021. confref identifier e11ac2s. https://id.confref.org/event/e11ac2s

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