Event Beta

Proceedings of the Seventeenth International Conference on Tangible, Embedded, and Embodied Interaction, TEI 2023, Warsaw, Poland, 26 February 2023- 1 March 2023

Name: Proceedings of the Seventeenth International Conference on Tangible, Embedded, and Embodied Interaction, TEI 2023, Warsaw, Poland, 26 February 2023- 1 March 2023
Location: Warsaw

Date: 2023
Place: Warsaw, Poland on the map
Series: Tangible, Embedded, and Embodied Interaction
Academic field: Natural sciences: Computer and information sciences
Disciplines: human–computer interaction
Identifier: https://id.confref.org/event/e11x1d7

Proceedings

Title	DOI	Year	Record
Proceedings of the Seventeenth International Conference on Tangible, Embedded, and Embodied Interaction, TEI 2023, Warsaw, Poland, 26 February 2023- 1 March 2023	10.1145/3569009	2023	dblp

Sources

The records of the sources that this identifier brings together (cr:sameAs).

dblp	`https://dblp.org/db/conf/tei/tei2023`

Cite

Proceedings of the Seventeenth International Conference on Tangible, Embedded, and Embodied Interaction, TEI 2023, Warsaw, Poland, 26 February 2023- 1 March 2023. confref identifier e11x1d7. https://id.confref.org/event/e11x1d7

Data: Turtle · JSON-LD · N-Triples · RDF/XML

APIs · SPARQL · About the identifiers

Beta confref labs is under development. Identifiers are stable; pages, data and services can change.