Event Beta
3rd Intl. Microsystems, Packaging, Assembly & Circuits Technology Conf.
IMPACT 2008
- Date
- 2008-10-22/24
- Place
- Taipei, Taiwan on the map
- Attendance
- on site
- Status
- as scheduled
- Website
- http://www.impact-emap.org/2008/CallPaper
- Academic field
- Engineering and technology
- Identifier
https://id.confref.org/event/e1249k4
Sources
The records of the sources that this identifier brings together (cr:sameAs).
| ConfIDent |
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Cite
3rd Intl. Microsystems, Packaging, Assembly & Circuits Technology Conf.. confref identifier e1249k4. https://id.confref.org/event/e1249k4
Beta confref labs is under development. Identifiers are stable; pages, data and services can change.